Semiconductor apparatus

ABSTRACT

The need for mediation operation is eliminated by adoption of a connection topology in which a circuit for executing one transmission (TR —   00 T), and a circuit for executing a plurality of receptions (TR —   10 R, TR —   20 R, TR —   30 R) are connected to one penetration-electrode group (for example, TSVGL —   0 ). In order to implement the connection topology even in the case of piling up a plurality of LSIs one after another, in particular, a programmable memory element for designating respective penetration-electrode ports for use in transmit, or for us in receive, and address allocation of the respective penetration-electrode ports is mounted in stacked LSIs.

CLAIM OF PRIORITY

The present application claims priority from Japanese patent applicationJP 2008-322224 filed on Dec. 18, 2008, the content of which is herebyincorporated by reference into this application.

FIELD OF THE INVENTION

The present invention relates to a semiconductor apparatus, and morespecifically, to a communication system of a semiconductor apparatuswith stacked LSIs (Large Scale Integration) mounted therein.

BACKGROUND OF THE INVENTION

With an LSI, as further progress has been made in micro-fabricationtechnology, so a greater number of transistors have been integrated onone chip, having thereby attempted to achieve enhancement inperformance. However, due to limitations to miniaturization, an increasein cost of utilizing a leading-edge process, and so forth, it will notnecessarily provide the optimal solution to a problem to promote furtherintegration of the transistors on one chip as in the past. Accordingly,integration in three-dimensional directions, implemented by piling up aplurality of LSIs, will become a technology that is highly hoped for.

In order to obtain a desired performance of stacked LSIs, communicationfunction among LSIs piled up one after another is important. One offavorite solutions to a problem of the communication system for thestacked LSIs is multiple-pin 3D communication by use of a siliconpenetration-electrode. Thus, in JP-A-2007-158237, use is made of abus-connection system whereby circuits on a plurality of LSIs haveauthority for outputting to a specific penetration-electrode, as asystem for making connection among the stacked LSIs through theintermediary of the silicon penetration-electrode.

SUMMARY OF THE INVENTION

Use of, for example, the bus-connection system shown in JP-A-2007-158237is at an advantage in that a multitude of LSIs can share apenetration-electrode. On the other hand, with this system, if signalsare outputted concurrently from a plurality of LSIs, correctcommunication cannot be established, so that in such a case, there willbe the need for mediation in right of use by the penetration-electrode,whereby concurrent outputs are rendered one output. JP-A-2007-158237 isconcerned with stacked memories, and all the stacked memories areactivated against a memory access-request from outside (because anaccess-request source is one), so that mediation control is unnecessary,and the system described in JP-A-2007-158237 is therefore suitable.

However, in the case where logic LSIs with independently operatingprocessor, and so forth, mounted thereon, respectively, are piled up oneafter another, there will be many occasions when the system wherein theplurality of the LSIs each have an authority for outputting to onepenetration-electrode is not optimal. This is because the respectiveLSIs gain access by use of the penetration-electrode at optional timing,and therefore, mediation for acquiring the right of use by thepenetration-electrode before outputting to the penetration-electrodewill become indispensable, so that an increase in overhead time willoccur due to the mediation, resulting in an increase in latency forcommunication, and deterioration in communication throughput. Further,the fact that the respective LSIs normally operate according to clocksout of sync with each other is one of the causes for the increase in theoverhead time.

Ethernet (registered trade mark) for use in Internet, and so forth canbe cited as an example of systems wherein a plurality of LSIs output toone common interconnection. Techniques for use in this case include asystem wherein a specific LSI senses information on a commoninterconnection when attempting to output thereto, and if the commoninterconnection is in use, the LSI waits for random time beforeattempting to output again. With this system, utilization of the commoninterconnection is not so high, and communication frequency is not sohigh either (for example, 1 GHz or less), so that the system iseffective because the number of interconnections can be reduced if anincrease in transfer latency is permissible. However, in the case ofcommunication between LSIs by use of the penetration-electrode, thissystem is unsuitable because a utilization ratio is high, communicationfrequency is often in excess of GHz, and very low transfer latency isrequired. Furthermore, use of the penetration-electrodes has a featurein that many interconnections can be used, so that constraints on thenumber of interconnections are not severe, and there is difficulty inenjoying the advantage.

With stacked LSIs incorporating logic LSIs with, independently operatingprocessor, and so forth, mounted thereon, respectively, there are theneeds for a system for high-frequency communication high in throughput,and low in transfer latency. The present invention has been developed inthe light of the problems described. The above and other objects, andnovel features of the present invention will be apparent from thefollowing detailed description of the preferred embodiments of theinvention in conjunction with the accompanying drawings.

Overview of a representative embodiment of the invention, disclosedunder the present application, is briefly described as follows. With theadoption of a connection topology wherein a circuit for executing onetransmission, and a circuit for executing a plurality of receptions areconnected to one penetration-electrode, high-throughput transfer isenabled while transfer latency is minimized. In order to implement theconnection topology even in the case of piling up a plurality of LSIsone after another, in particular, a programmable memory element fordesignating respective penetration-electrode ports for use in transmit,or for us in receive, and designating address-routing for the respectivepenetration-electrode ports is mounted in stacked LSIs.

To briefly describe an advantageous effect of the representativeembodiment of the invention, disclosed under the present application, itis possible to establish communication low in latency, and high inthroughput between respective LSIs of the stacked LSIs.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic representation showing one example of aconfiguration of a semiconductor apparatus according to a firstembodiment of the invention;

FIG. 2 is a view showing communication paths between LSIs piled up oneafter another in FIG. 1;

FIG. 3 is a view showing one example of a configuration of apenetration-electrode transmit/receive circuit in FIG. 1;

FIG. 4 is a view showing one example of a configuration of a logic LSIin FIG. 1;

FIG. 5 is a view showing one example of a timing chart in communicationusing penetration-electrode, groups, as in FIGS. 1 and 3;

FIG. 6 is a view showing one example of another timing chart incommunication using penetration-electrode groups, as in FIGS. 1 and 3;

FIG. 7 is a schematic representation showing one example of aconfiguration of a semiconductor apparatus according to a thirdembodiment of the invention;

FIG. 8 is a view showing detailed contents of registers for varioussetting, in FIG. 4, by way of example;

FIG. 9 is a schematic representation showing one example of aconfiguration of a semiconductor apparatus according to a fourthembodiment of the invention;

FIG. 10 is a view showing a configuration of a penetration-electrodetransmit-circuit shown in FIG. 1 by way of example;

FIG. 11 is a view showing a configuration of a penetration-electrodereceive-circuit shown in FIG. 1 by way of example; and

FIG. 12 is a schematic representation showing one example of aconfiguration of the principal part a semiconductor apparatus accordingto a second embodiment of the invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

It is to be understood that the number of elements, and so forth(including the number of pieces, numerical values, quantities, scopes,and so forth), as referred to in the following embodiments of theinvention, be not limited to a specific number referred to, and may benot less than the specific number, or not more than the specific numberunless, for example, specifically and explicitly limited thereto, orobviously limited thereto in theory. Further, it is obvious thatconstituent elements (including element steps, and so forth) referred toin the following embodiments of the invention are not necessarilyessential unless, for example, explicitly described as essential, orobviously deemed essential in theory. Similarly, it is to be understoodthat respective shapes of the constituent elements, and so forth,positional relationship thereof, and so forth, as referred to in thefollowing embodiments of the invention, be meant to include shapes, andso forth, effectively approximate to, or similar to the shapes of theconstituent elements, and so forth, unless, for example, specificallyand explicitly described otherwise, or obviously deemed otherwise intheory. The same applies to the numerical values, and scopes, describedas above.

Further, there is no particular limitation to a circuit element as aconstituent of respective function blocks in the embodiment of theinvention, and the circuit element is formed on a semiconductorsubstrate such as single crystal silicon by use of the integratedcircuit technology for the known CMOS (Complementary MOS transistor),and so forth. The embodiments of the invention will be described indetail hereinafter with reference to the accompanying drawings. In allfigures for use in describing respective embodiments of the invention,identical members are in principle denoted by like reference numerals,omitting repeated description thereof.

First Embodiment

FIG. 1 is a schematic representation showing one example of aconfiguration of a semiconductor apparatus according to a firstembodiment of the invention. The semiconductor apparatus in FIG. 1 is inthe form of stacked LSIs composed of four layers of logic LSIs (LSIL_0,LSIL_1, LSIL_2, LSIL_3), and two layers of memory LSIs (LSIM_0, LSIM_1),piled up one another, wherein connection between the respective LSIs isimplemented with a penetration-electrode. The four logic LSIs each are,for example, an identical LSI, on which a functional unit such as CPU(Central Processing Unit), and so forth is mounted. The two memory LSIseach are also, for example, an identical LSI, on which a memory array,such as DRAM, and so forth, is mounted. TSVGL_0, TSVGL_1, TSVGL_2, andTSVGL_3 each denote a penetration-electrode group for establishingcommunication between the respective logic LSIs while TSVGM_0, andTSVGM_1 each denote a penetration-electrode group for establishingcommunication between the logic LSI, and the memory LSI.

In the logic LSIs, TR_00T, TR_01R, TR_02R, TR_03R, TR_10R, TR_11T,TR_12R, TR_13R, TR_20R, TR_21R, TR_22T, TR_23R, TR_30R, TR_31R, TR_32R,TR_33T each denote a penetration electrode transmit/receive circuit (TR)connected to the penetration-electrode group for interconnecting betweenthe respective logic LSIs. Those penetration-electrode transmit/receivecircuits each are capable of designating whether the circuit is to beused as a transmit-circuit or a receive-circuit according to an electricsignal. In FIG. 1, TR_00T, TR_11T, TR_22T, and TR_33T each aredesignated as the transmit-circuit, and the rest are each designated asthe receive-circuit. As a result of adoption of a configuration whereintransmit/receive can be designated after manufacture of LSIs as above,those LSIs can be rendered identical to each other.

Further, among the logic LSIs, T_04T, T_06F, T_14F, T_16T, T_24F, T_26F,T_34F, and T_36F each denote a penetration-electrode transmit-circuitfor issuing a memory access right to respective penetration-electrodegroups, interconnecting between the logic LSIs, and the memory LSIs, andthose penetration-electrode transmit-circuits each are capable ofdesignating whether or not transmission is to be executed according toan electric signal. In FIG. 1, T_04T, and T_16T are set so as totransmit a signal while T_06F, T_14F, T_24F, T_26F, T_34F, and T_36Feach are set so as not to transmit/receive a signal. Further, R_05R,R_07F, R_15F, R_17R, R_25F, R_27F, R_35F, and R_37F each denote apenetration-electrode receive-circuit for receiving a memory accessresult from the respective penetration-electrode groups, interconnectingbetween the respective logic LSIs, and the respective memory LSIs, andthose penetration-electrode receive-circuits each is capable ofdesignating whether or not reception by an electric signal is to beexecuted according to the electric signal. In FIG. 1, R_05R, and R_17Rare set so as to receive a signal, and the rest are set so as not toreceive a signal.

Meanwhile, in the memory LSIs, R_44R, R_46R, R_54R, and R_56R eachdenote a penetration-electrode receive-circuit for receiving the memoryaccess right from the respective penetration-electrode groupsinterconnecting between the respective logic LSIs, and the respectivememory LSIs. Further, T_45T, T_47T, T_55T, and T_57T each denote apenetration-electrode transmit-circuit for transmitting the memoryaccess result to the respective penetration-electrode groupsinterconnecting between the respective logic LSIs, and the respectivememory LSIs. Further, in the logic LSIs, FUNC_0, FUNC_1, FUNC_2, andFUNC_3 each denote a logic circuit including a functional unit such asCPU, and so forth while in the memory LSIs, MEM_40, MEM_41, MEM_50, andMEM_51 each denote a memory block including a memory array.

Communication between the stacked LSIs in FIG. 1 is established throughthe intermediary of the respective penetration-electrode groups. FIG. 2shows paths through which communication is established between the LSIsin the circuit shown in FIG. 1. In FIG. 2, there are shown communicationpaths from FUNC_0, and FUNC_3, respectively, through the intermediary ofthe respective penetration-electrode groups by way of example. Forexample, in the case where a circuit in FUNC_0 of LSIL_0 makes aread-request to a circuit in FUNC_1 of LSIL_1, FUNC_0 issues theread-request, TR_00T transmits the read-request to thepenetration-electrode group TSVGL_0, and TR_10R receives theread-request, transmitting the read-request to FUNC_1, whereupon FUNC_1executes processing of the read-request, TR_11T transmits a responsethereto to the penetration-electrode group TSVGL_1, TR_01R receives theresponse to thereby transmit the same to FUNC_0, whereupon FUNC_0receives the read-request, completing read processing (line no. 1 inFIG. 2).

Further, to take another example, in the case where a circuit in FUNC_0of LSIL_0 makes a read-request to MEM_40 of LSIM_0, FUNC_0 issues aread-request, T_04T transmits the read-request to thepenetration-electrode group TSVGM_0, and R_44R receives theread-request, thereby transmitting the read-request to MEM_40, whereuponMEM_40 executes processing of the read-request, T_45T transmits aresponse thereto to the penetration-electrode group TSVGM_1, R_05Rreceives the response to thereby transmits the same to FUNC_0, whereuponFUNC_0 receives the read-request, completing read processing (line no. 4in FIG. 2).

Still further, to take still another example, in the case where acircuit in FUNC_3 of LSIL_3 makes a read-request to MEM_51 of LSIM_3,FUNC_3 issues a read-request, TR_33T transmits the read-request to thepenetration-electrode group TSVGL_3, and TR_13R receives theread-request, whereupon T_16T transmits the read-request to TSVGM_2through the intermediary of FUNC_1, and R_56R receives the read-requestto thereby transmit the same to MEM_51, whereupon MEM_51 executesprocessing of the read-request, T_57T transmits a response thereto tothe penetration-electrode group TSVGM_3, and R_17R receives theresponse, whereupon TR_11T transmits the response to thepenetration-electrode group TSVGL_1 through the intermediary of FUNC_1,and TR_31R receives the response, whereupon FUNC_3 receives theread-request, completing read processing (line no. 14 in FIG. 2).

If an alternate path can be set up, as is the case of line no. 14, thiswill enable communication between the respective logic LSIs, and therespective memory LSIs to be executed with the use of thepenetration-electrode groups fewer in number even in the case where aplurality of the memory blocks are provided in one memory LSI. That is,if only one logic LSI can communicate with one memory block in therespective memory LSIs through the intermediary of onepenetration-electrode group, this will enable a logic LSI not directlyconnected to communicate with the memory block through the intermediaryof the one logic LSI. Assuming that two or more logic LSIs cancommunicate through the intermediary of the one penetration-electrodegroup, mediation as previously described is required, so that therearises the necessity of adding another penetration-electrode group,resulting in an increase in the number of the penetration-electrodegroups.

With the embodiment shown in FIG. 1, a configuration is adopted whereinthe circuit for executing one transmission, and the circuit forexecuting a plurality of receptions are connected to a certainpenetration-electrode group for establishing connection between thelogic LSIs. To take an example, setting is made such that only TR_00Ttransmits to the penetration-electrode group TSVGL_0 while TR_10R,TR_20R, and TR_30R each execute only reception without executingtransmission. This setting is made according to a value of a memoryelement (TSVREG in FIG. 4) in LSI. The logic LSI includes anactively-operating circuit such as CPU, and so forth, and if aconfiguration is adopted, wherein one penetration-electrode group isshared by circuits executing a plurality of transmissions, the mediationin the right of use by the penetration-electrode is required before useof the penetration-electrode, as described in the paragraph underheading of SUMMARY OF THE INVENTION, thereby causing occurrence ofoverhead time between transfer packets. Clocks are normally out of syncwith each other between stacked LSIs, and the overhead time is normallylarge and non-negligible. Accordingly, if use is made of a configurationwherein a circuit for executing one transmission, and a circuit forexecuting a plurality of receptions are connected to onepenetration-electrode group, an advantage is gained in that the overheadtime can be checked, and communication control will be simpler becausethere will be no need for the mediation with respect to the right ofuse.

Further, peer-to-peer connection whereby receive circuits connected toone penetration-electrode group are unified can be contemplated,however, in the case of piling up identical chips, it is not possible todelete parasitic loads of receive-circuits physically out of use even ifa peer-to-peer connection structure is adopted, so that an effect ofhigher speed cannot be gained. For this reason, one-to-multiplestructure, that is, a structure having multiple receptions against onetransmission is adopted in the embodiment of the invention, shown inFIG. 1. By so doing, transfer that is low in latency, and high inthroughput is enabled by making effective use of penetration-electroderesources.

Meanwhile, with respect to the penetration-electrode groups for use inthe memory LSI transmitting a response to the logic LSI, as well, it isobviously possible to adopt a configuration wherein only onepenetration-electrode transmit-circuit is connected to onepenetration-electrode group as previously described. However, adopted inthis case is a configuration wherein the one penetration-electrode groupis shared by the penetration-electrode transmit-circuits in theplurality of the memory LSIs by taking advantage of the fact that thememory LSIs each undergo a passive operation. T_55T, and T_45T eachtransmit to TSVGM_1, and T_47T, and T_57T each transmit to TSVGM_3. Thereason why the penetration-electrode group is shared by the plurality ofthe penetration-electrode transmit-circuits in the memory LSIs isbecause the memory LSIs each receive a request from the logic LSI, andundergo a passive operation by reacting to the request, so that it iseasy to control timing at which the plurality of LSIs transmit to thepenetration-electrode group to thereby eliminate the overhead timedescribed as above. Thus, adoption of the configuration wherein theplurality of the memory LSIs can be connected to the onepenetration-electrode group is advantageous in that a memory capacity tobe mounted can be easily varied by changing the number of stacked layersof a memory. A memory is a general-purpose component, having a requiredcapacity that is variable according to its application, and therefore,flexibility of a memory capacity, variable according to a finishedproduct, is regarded important from a standpoint of optimizingperformance, and cost.

FIG. 3 shows a configuration of the penetration-electrodetransmit/receive circuit (TR) in FIG. 1 by way of example. In FIG. 3,TCVR denotes a transceiver for executing transmission to apenetration-electrode group, RCVR a receiver circuit or executingreception from the penetration-electrode group, RFIFO a buffer circuitfor storing reception information acquired from RCVR, and TSVC, TSVQ,TSVD, TSVA each denote a penetration-electrode port connected to thepenetration-electrode group (TSVG) described in the foregoing. Thepenetration-electrode groups (TSVG) each are comprised of a plurality ofpenetration-electrodes, each of which is connected to thosepenetration-electrode ports. Further, TXC, TXOUT, TXQC, TXDC, RXDC,GNTOC, GNTOUT, and GNTIC each denote a signal line from inside of theLSI.

TSVD is the penetration-electrode port (signal) for informationtransmit/receive, and a transmit state thereof is designated by a TXOUTsignal (‘1’ for transmit, ‘0’ for receive). In FIG. 3, TSVD is shown asconnected to one length of line, but is normally connected to aplurality of lines. When TR is set to a transmit state by TXOUT,information such as command, an address, data, and so forth, deliveredfrom the signal line TXDC, is transmitted at timing designated by atrigger signal, such as clock, and so forth, inputted from the signalline TXC. When TR is set to a receive-state by TXOUT, information fromTXVD is fetched to RFIFO at timing designated by a signal received fromTSVC. RFIFO is a circuit for fetching the information from TXVD attiming designated by RSVC to thereby output the information to RXDC attiming designated by TXC, the circuit being comprised of memory circuitsin a plurality of stages. Communication between different clock domainscan be executed without data omission by the action of RFIFO.

TSVC is the penetration-electrode port (signal) for designating timingat which the information transmitted via TSVD is fetched at a receivingend, and is in a state where the transmit state thereof can bedesignated by the TXOUT signal, as is the case with TSVD. When TR is setto the transmit state by TXOUT, a signal generated on the basis of asignal delivered from the signal line TXC is outputted from TSVC. WhenTR is not set to the transmit state by TXOUT, the signal received fromTSVC is outputted to RFIFO. Examples of signals transmitted through TSVCinclude a transmit clock and so forth.

TSVQ is the penetration-electrode port (signal) for selecting areceive-circuit for fetching the information transmitted via TSVD. InFIG. 3, TSVQ is shown for connection to one length of line for brevity,but TSVQ is actually prepared for connection to each of lines in numberscorresponding to (the number of receive-circuits connected to targetpenetration-electrode groups in FIG. 1, respectively, minus 1). Thissignal is a signal outputted by a circuit set to a transmit-state to bethereby inputted to a circuit set to a receive-state. When TSVQ isasserted, the circuit set to the receive-state fetches the informationacquired via TSVD to RFIFO at timing designated by TSVC. On thecontrary, when this signal is not asserted, the information via TSVD isnot fetched. With a configuration according to the present embodiment ofthe invention, a plurality of the receive-circuits are connected to onepenetration-electrode group, as shown in FIG. 1, this signal designatinga receive-circuit will be beneficial. Without TSVQ, all thereceive-circuits need to fetch the information via TSVD once to therebydecode the information, determining on whether or not the information isnecessary, which will lead to an increase in circuit scale of thereceive-circuits, and an increase in power consumption forcommunication.

TSVA is the penetration-electrode port (signal) showing whether or notthe LSI at a receiving end can receive the information transmitted viaTSVD. This signal is a signal outputted by the circuit set to thereceive state to be thereby inputted to the circuit set to the transmitstate. In FIG. 3, TSVA is shown for connection to one length of line forbrevity, but TSVA is actually prepared for connection to each of linesin numbers more than the number of receive-circuits connected to targetpenetration-electrode groups in FIG. 1, respectively, and each of thepenetration-electrode transmit/receive circuits that has been set to thereceive state occupies TSVA. GNTOUT represents a signal for designatingtransmit/receive for TSVA. When TSVA is set to the receive state byGNTOUT, information delivered from GNTOC, indicating a receive-state istransmitted to TSVA. When TSVA is set to the receive state, a signalreceived from TSVA, indicating the receive state, is outputted to GNTIC.

With the present embodiment of the invention, clocks are notsynchronized between the stacked LSIs. Clock synchronization between thestacked LSIs is, in theory, possible, however, it will be difficult torealize enhancement in clock frequency. For this reason, a circuit fortransmitting information to the penetration-electrode group outputs atiming signal for fetching the information on TSVD in thereceive-circuit to TSVC, in parallel with information transmitted viaTSVD, thereby establishing communication between the LSIs with clocksout of sync with each other.

FIG. 10 is a view showing a configuration of the penetration-electrodetransmit-circuit (T) shown in FIG. 1 by way of example. FIG. 10 showsthe configuration of the penetration-electrode transmit/receive circuit(TR) shown in the FIG. 3, after removal of a signal-receive portionthereof. TSVD is the penetration-electrode port for outputting theinformation such as a command, an address, data, and so forth, deliveredfrom the signal line TXDC, the information being outputted to TSVD atthe timing designated by the trigger signal, such as clock, and soforth, inputted from the signal line TXC. TSVC is thepenetration-electrode port for transmitting the timing at which theinformation is fetched in a receive-circuit, and the signal generated onthe basis of the signal delivered from the signal line TXC is outputtedfrom TSVC. TSVQ is the penetration-electrode port for selecting thereceive-circuit for fetching the information transmitted via TSVD, and asignal inputted from the signal line TXQC is outputted thereto at timingdesignated by the trigger signal, such as clock, and so forth. TSVA isthe penetration-electrode port (signal) showing whether or not the LSIat the receiving end can receive the information transmitted via TSVD.Since the circuit in FIG. 10 is a transmit-circuit, the circuit receivesa signal from TSVA. Further, TSVD is not necessarily required. When thetransmit-circuit in FIG. 10 execute transmit, TXOUT is asserted (thesignal is turned ‘1’) only at transmit-timing. Further, in the case ofsetting where transmit is not executed (that is, in the cases of T_06F,and so forth, in FIG. 1), TXOUT is fixed at ‘0’ all the time.

FIG. 11 is a view showing a configuration of the penetration-electrodereceive-circuit shown in FIG. 1 by way of example. FIG. 11 shows theconfiguration of the penetration-electrode transmit/receive circuit (TR)shown in the FIG. 3, after removal of a signal-transmit portion thereof.TSVD is the penetration-electrode port for receiving information such asa command, an address, data, and so forth, outputted by thepenetration-electrode transmit-circuit, and when thepenetration-electrode port (signal) TSVQ is asserted, the information isfetched to RFIFO at timing designated by a trigger signal inputted fromthe penetration-electrode port TSVC. TSVA is the signal showing whetheror not the LSI at the receiving end can receive the informationtransmitted via TSVD. In the receive-circuit shown in FIG. 11, a signalis outputted from TSVA when GNTOUT is at “1”. Further, in the case ofsetting where transmit is not executed (that is, in the cases of R_07F,and so forth, in FIG. 1), a TXOUT signal is fixed at ‘0’ all the time.By so doing, the information from TSVD is not fetched to RFIFO, so thatany extra operation can be checked.

FIG. 4 shows a configuration of the logic LSI (LSIL_0) in FIG. 1 by wayof example. Portions of the logic LSI, excluding TR_00T, TR_01R, TR_02R,TR_03R, T_04T, R_05R, T_06F, and R_07F, shown in FIG. 4, and thepenetration-electrode ports, are included in FUNC_0 in FIG. 1. PU_0, andPU_1 each denote a processor circuit such as a CPU, and so forth, INI inthe processor circuit denotes a request-processing block for issuing anaccess-request to other circuits, including a read-request, to therebyreceive a response thereto, and conversely, TGT denotes aresponse-processing block for receiving the access-request from othercircuits, thereby responding thereto.

TRCA denotes a circuit for controlling the penetration-electrodetransmit/receive circuit (TR), TRCB a circuit for controlling thepenetration-electrode transmit-circuit (T), and TRCC a circuit forcontrolling the penetration-electrode receive-circuit (R). ARBQ, andARBS each denote a routing-switch circuit for establishing communicationamong those circuits. ARBQ, and ARBS each have a role for determining adestination circuit on the basis of destination-information contained incommunication information among those circuits to thereby transmit thecommunication information to a target circuit (routing function). ARBQexecutes routing of a request from a circuit to another circuit, such asa read-request, and so forth, and ARBS executes routing of a reply tothe request (for example, readout-data). TSVREG denotes a programmablememory circuit (a register for various setting) holding various setinformation containing information, and so forth, for use in routing.Besides, CLKG denotes a clock-feed circuit for feeding a clock to acircuit to be mounted, and IDGEN denotes an identifier-generationcircuit for generating identifiers for use in distinguishing betweenLSIs at the time of piling up identical LSIs.

With the embodiment shown in FIG. 1, a plurality of identical LSIs arestacked one another. In this case, in order to realize a connectiontopology wherein a circuit for executing one transmission, and a circuitfor executing a plurality of receptions are connected to the onepenetration-electrode group described in the foregoing, it is necessaryto be able to designate whether the penetration-electrode ports atidentical positions on the respective LSIs are for use in transmission,or for use in reception on a LSI-by-LSI basis after manufacturing. Inaddition, it is necessary to be able to designate routing information onthe penetration-electrode ports at the identical positions on therespective LSIs on the LSI-by-LSI basis after manufacturing. TSVREGincludes register circuits for storing information for designating thosedescribed as above, and is described in detail hereinafter.

TRTBL is a penetration-electrode transmit/receive setting register fordesignating whether the penetration-electrode port is for use intransmission, or for use in reception against the penetration-electrodetransmit/receive circuit, and for storing information designatingwhether or not the penetration-electrode transmit-circuit, and thepenetration-electrode receive-circuit are set to a state enablingtransmission from the penetration-electrode port, and a state enablingreception to the penetration-electrode port, respectively. With theexample shown in FIG. 4, designation of TR_00T for use in transmission,designation of TR_01R, TR_02R, and TR_03R, for use in transmission,designation to set T_04T, and R_05R to a state enabling transmission,and reception, respectively, and designation to set T_06F, and R_07F toa state preventing transmission, and reception, respectively, are storedin TRTBL. With the penetration-electrode transmit/receive circuit, theTXOUT signal in FIG. 3 is controlled on the basis of such information.As shown in FIG. 8, TRTBL includes registers for designatingtransmit/receive for every TRCA, and registers for designating atransmit state/a receive state for every TRCB and TRCC.

RQTBL is a register for storing routing information for designating atransmit-destination of access-request communication information(access-request such as a read-request) against the switch circuit ARBQ.The access-request communication information contains a command, adestination-address, data, and an access-source-circuit identificationinformation, and ARBQ executes routing on the basis of thedestination-address. The access-source-circuit identificationinformation (referring to, for example, PU_0) is for use in routing ofresponse information against the access-request to thereby deliver theresponse information to an access-source-circuit. SRC in PU_0 as well asPU_1 is a memory element for storing the access-source-circuitidentification information. A portion of a value of the SRC is generatedon the basis of a value of LSIIDR to be described later in the presentdescription, and even if LSIs of the same type are stacked, respectivecircuits can be provided with identification information units differingfrom each other, so that it is possible to effect routing of theresponse information even when the LSIs of the same type are stacked.

To go into more detail, RQTBL is a table for use in designating whichcommunication information within a destination address range is to betransmitted to which circuit (the penetration-electrode control circuitRCA, or TRCB) connected to ARBQ, or either PU_0 or PU_1. As shown byRQTBL in FIG. 8, RQTBL includes registers for designating a destinationaddress range against every TRCA, every TRCB, PU_0 and PU_1. With therespective registers, a plurality of address ranges can be designated.For example, with the embodiment shown in FIG. 1, when an access is madefrom the processor circuit PU_0 within FUNC_0 to a resource withincircuit FUNC_3, ARBQ in LSIL_0 must transfer a request from PU_0 toTR_00T, but when an access is made from the processor circuit PU_0within FUNC_1 to the resource within circuit FUNC_3, ARBQ in LSIL_1transfer the request from PU_0 to TR_11T. Those requests each have thesame destination address, however, respective ARBQs of the LSIs need totransfer information to the penetration-electrode ports on the LSIs,differing from each other.

In order to realize the above, ARBQ has a mechanism capable ofdesignating information about which access-request communicationinformation having a destination address in a specific address range maybe transmitted to which circuit (TRCA, TRCB, PU_0 and PU_1), that is,(information about which penetration-electrode group may be used inorder to transmit to a specific destination address) on the basis of avalue of RQTBL. For example, an address range for routing to a specificTRCA is described in one of elements of RQTBL. In so doing, even in thecase of a configuration wherein the identical LSIs are stacked, it ispossible to realize a topology wherein one transmit-circuit, and aplurality of receive-circuits are connected to one penetration-electrodegroup, as shown in FIGS. 1, and 2.

RSTBL is a register for storing a routing table for response information(readout data, and so forth) against the switch circuit ARBS. With thepresent embodiment of the invention, the response information asdestination information contains an access-source circuit identifier.RSTBL also is a register for designating information concerning to whichcircuit transmission of response information units having respectiveaccess-source circuit identifiers is to be executed. As shown by RSTBLin FIG. 8, RSTBL has registers designating which response informationunit having a specific access-source circuit identifier is to betransmitted to respective circuits including respective TRCAs, PU_0, andPU_1. For example, combination of access-source circuit identifiers forrouting to a specific TRCA is described in one of elements of RSTBL.Since the tip of the penetration-electrode port leading to a specificTRCA, or TRCC is normally connected to a plurality of circuit blocks, aplurality of the circuit identifiers can be designated for therespective registers.

LSIIDR denotes a register for storing LSI identifiers. In the case wherethe plurality of the identical LSIs are stacked one another, LSIIDR isrequired to differentiate between the LSIs. Information stored in LSIIDRis inputted from IDGEN via an LSIIDS signal. IDGEN has independentpenetration-electrode ports LCK, LCMD, and LDT, for writing informationon the identifiers from outside LSIs. LCK denotes apenetration-electrode port for clock, LSMD a penetration-electrode portfor command, LDT a penetration-electrode port for informationinput/output. LDT has a structure for interconnecting an electrode on aLSI circuit plane via a plurality of flip-flop circuits connected inseries thereto, and an electrode on a substrate plane. The LSIidentifier is shift-inputted from the electrode on the circuit plane ofLDT by use of this chain structure. LCK, and LCMD are for use incontrolling a shift operation.

As a method for setting a value to TRTBL, RQTBL, and RSTBL, as above,respectively, there is available a method for adding setting-codes forthose registers to a boot program of PU_0. The register setting-codereads an LSIIDR value to thereby set a value corresponding to theidentifier of the LSIIDR to TRTBL, RQTBL, and RSTBL, respectively. REGBSdenotes a signal line for setting a value from PU_0, and PU_1,respectively, to TSVREG in FIG. 4.

If TSVREG is provided as above, it is possible to form a freely-stackedtopology even in the case of stacked layers of the identical LSIs.Further, the connection topology of the stacked LSIs can be variedaccording to a finished product, thereby enhancing general versatility.Furthermore, with the use of such a structure, it is possible to realizea connection topology without the use of a faulty penetration-electrodegroup, having an effect of enhancement in yield.

Further, as the method for setting a value to TRTBL, RQTBL, and RSTBL,respectively, there is available another method for automatic settingfrom a circuitry standpoint on the basis of an LSIIDR value. LSIIDM inFIG. 4 denotes a signal line provided for this purpose. While thismethod has a advantage in that the boot program does not require theregister setting-code, flexibility will be lower.

Now, operation of the logic LSI having the configuration shown in FIG. 4is briefly described as follows. For example, a case is assumed wherePU_0 (refer to FIG. 4) of LSIL_0 in FIG. 1 issues a request to PU_0 ofLSIL_1 via TR_00T, and PU_0 of LSIL_0 receives a response correspondingto the request via TR_01R. In this case, first, INI in PU_0 of LSIL_0outputs the request containing the logic LSI's own identifier (SRC), anda destination address (expressing PU_0 of LSIL_1) to ARBQ. ARBQ executesrouting corresponding to the destination address on the basis of RQTBL,and as a result, the request is transmitted to TR_00T via TRCA.

Subsequently, LSIL_1 receives the request from TR_10R, transmitting thesame to ARBQ via the relevant TRCA. ARBQ executes routing correspondingto the destination address on the basis of RQTBL, and as a result, therequest is transmitted to TGT of PU_0. Thereafter, predeterminedprocessing by PU_0 is executed, and subsequently, TGT extracts theidentifier contained in the request, issuing a response containing theidentifier to ARBS. ARBS executes routing corresponding to theidentifier on the basis of RSTBL, and as a result, the response istransmitted to TR_11T via TRCA. Subsequently, LSIL_0 receives theresponse from TR_01R, transmitting the same to ARBS via the relevantTRCA. ARBS executes routing corresponding to the identifier on the basisof RSTBL, and as a result, the response is transmitted to INI of PU_0.

Due to such an operation as described above, INI in PU_0 of LSIL_0outputs the request, thereby receiving the response thereto. On theother hand, TGT in PU_0 of LSIL_1 receives the response, thereby issuingthe response thereto. Accordingly, in PU_0s of the respective LSIs, INIand TGT each will be independently operable, and by so doing, higherprocessing efficiency can be realized, so that communication low inlatency, and high in throughput can be established between therespective LSIs.

FIG. 5 shows time-dependent change in respective signals on thepenetration-electrode ports in FIG. 3 by taking an example where thecircuit PU_0 inside FUNC_0 of LSIL_0 shown in FIG. 1 executes readinginto FUNC_2 of LSIL_2 through the intermediary of TSVGL_0. In FIG. 5,the horizontal axis represents time. An upper time chart relates tosignals of TSVGL_0, and a lower time chart relates to signals ofTSVGL_2. In FIG. 5, a read-request is outputted from LSIL_0 to TSVGL_0,and a read-result is outputted from LSIL_2 to TSVGL_2.

Issuing of a read-request is described hereinafter. TSVA_10 denotes asignal (refer to TSVA in FIG. 3) indicating a receive-enable state foraccess to LSIL_1 via TSVGL_0, TSVA_20 a signal (refer to TSVA in FIG. 3)indicating a receive-enable state for access to LSIL_2 via TSVGL_0, andTSVA_30 a signal (refer to TSVA in FIG. 3) indicating a receive-enablestate for access to LSIL_3 via TSVGL_0. Further, TSVD_00 denotesinformation transmitted by LSIL_0 (corresponding to TSVD in FIG. 3), andTSVC_00 denotes a clock transmitted by LSIL_0 (corresponding to TSVC inFIG. 3). Still further, TSVQ_01 denotes a signal outputted from LSIL_0,the signal indicating that there exists an access request to thereceive-circuit of LSIL_1 via TSVGL_0, TSVQ_02 a signal outputted fromLSIL_0, the signal indicating that there exists an access request to thereceive-circuit of LSIL_2 via TSVGL_0, and TSVQ_03 a signal outputtedfrom LSIL_0, the signal indicating that there exists an access requestto the receive-circuit of LSIL_3 via TSVGL_0.

With the example shown in FIG. 5, LSIL_0 detects that TSVA_20 is turned“1” indicating LSIL_2 in the receive-enable state, subsequently issuinga read-request CMDRQ to TSVD_00 (timing TM_02 in FIG. 5). Concurrentlywith the issuing of the read-request, the signal TSVQ_02 is asserted.CMDRQ contains information directing an LSI at an access destination (inthis case, LSIL_2), an access destination address, and theaccess-source-circuit identification information (information indicatingPU_0 of LSIL_0, for use as the destination information upon sending theread-result back to PU_0). Further, in the figure, CMDNOP hasinformation indicating that an effective command has not been issued.

Issuing of a read-result is described hereinafter. TSVA_02 denotes asignal (refer to TSVA in FIG. 3) indicating a receive-enable state foraccess to LSIL_0 via TSVGL_2, the signal being one outputted by LSIL_0.TSVA_12 denotes a signal (refer to TSVA in FIG. 3) indicating areceive-enable state for access to LSIL_1 via TSVGL_2, the signal beingone outputted by LSIL_1. TSVA_32 denotes a signal (refer to TSVA in FIG.3) indicating a receive-enable state for access to LSIL_3 via TSVGL_2,the signal being one outputted by LSIL_3. TSVQ_20 denotes a signaloutputted from LSIL_2, the signal indicating that there exists an accessrequest to the receive-circuit of LSIL_0 via TSVGL_2, TSVQ_21 a signaloutputted from LSIL_2, the signal indicating that there exists an accessrequest to the receive-circuit of LSIL_1 via TSVGL_2, and TSVQ_23 asignal outputted from LSIL_2, the signal indicating that there exists anaccess request to the receive-circuit of LSIL_3 via TSVGL_2. TSVD_22denotes information transmitted by LSIL_2 (corresponding to TSVD in FIG.3), and TSVC_22 denotes a clock transmitted by LSIL_2 (corresponding toTSVC in FIG. 3).

With the example shown in FIG. 5, LSIL_2 acquires a read-result againstthe read-request CMDRQ, detecting that TSVA_02 is turned “1” indicatingLSIL_0 in the receive-enable state, and issues thereafter theread-result to TSVD_22. The read-result is composed of one-cycle CMDRS,two-cycle DTRS. CMDRS indicates the read-result against the read-requestCMDRQ, containing information directing the LSI at the accessdestination (in this case, LSIL_0), and information indicating atransmit-destination (the same as the access-source-circuitidentification information in CMDRQ). Further, in the figure, CMDNOP hasinformation indicating that an effective command has not been issued.Still further, concurrently with issuing of CMDRS, and DTRS, the signalTSVQ_20 is asserted, posting a receive-circuit that effectiveinformation is outputted to TSVD_22.

Since the signals (TSVA) indicating the receive-enable state areprovided, as shown in FIGS. 3, and 5, access at a transmitting end canbe stopped before a receive-buffer at a receiving end is filled to abrim. Such a mechanism as described has effects of not only preventingoverflow from occurring to the receive-buffer at the receiving end butalso reducing a receive-buffer capacity. As a form whereby thereceive-enable state is similarly posted to the transmitting end, thereis also available a method for posting to the transmitting end as one ofcommand information from a receive-circuit to a transmit-circuit (inFIG. 5, command information on TSVD_22). In this case, there areavailable a method whereby a command for temporarily stopping/resumingtransmission to a specific receive-circuit is mounted and a methodwhereby a command for posting the number of receivable data blocks of aspecific receive-circuit is mounted. Those methods have a drawback inthat TSVD is consumed for some period of time, but have an advantage inthat the same effect as that for the exclusive signal line (TSVA) can begained, thereby eliminating the need for an exclusive line.

FIG. 6 shows time-dependent change in respective signals on thepenetration-electrode ports in the case where the circuit inside FUNC_0of LSIL_0 executes reading into FUNC_2 of LSIL_2 through theintermediary of TSVGL_0, as in the case shown in FIG. 5. FIG. 6 differsfrom FIG. 5 only in respect of operations of TSVC_00 and TSVC_22. Incontrast to the case of the example show in FIG. 5, a clock signal istransmitted to those penetration-electrode ports, a pulse signal isimpressed thereon only when effective information is transmitted toTSVD_00, and TSVD_22 in the case of the example show in FIG. 6. Thepulse signal indicates data-fetch timing on TSVD_00, and TSVD_22. Withthe method shown in FIG. 6, consumed power is rendered lower as comparedwith the method shown in FIG. 5.

Thus, with the use of the semiconductor apparatus according to the firstembodiment of the invention, overhead time due to mediation can bechecked, so that communications low in latency, and high in throughputcan be established between the respective LSIs, typically in respect ofthe stacked LSIs.

Second Embodiment

FIG. 12 is a schematic representation showing one example of aconfiguration of the principal part a semiconductor apparatus accordingto a second embodiment of the invention. In FIG. 12, with the case ofthe four layers of the logic LSIs (LSIL_0 to LSIL_3), shown in FIG. 1,taken by way of example, there is shown a connection form of the clocksignals. CLKG denotes a clock-feeding circuit, composed of anoscillation circuit OCM, a clock-selector circuit CSEL, and a frequencydivider DIVM. Call refers to all parts except CLKG, and CKREG in Calldenotes a programmable memory element for controlling CLKG.

OCM is the oscillation circuit for generating an LSI internal clock onthe basis of a clock inputted from outside stacked LSIs via apenetration-electrode TSVCS0. CLK3 denotes a signal line fortransmitting the LSI internal clock generated by OCM to CSEL. CLK2denotes a signal line for transmitting the LSI internal clock generatedby OCM to a penetration-electrode TSVCS1, as is the case with CLK3.Output signals of OCM to CLK2, and CLK3, respectively, can be set so asnot to be outputted inside OCM (high•impedance). Such setting is storedin a part of the memory element CKREG inside Call to be posted to OCM bya CTRI signal. This setting can be made after LSI activation, and theinitial value thereof indicates CLK3 in a clock-output state, and CLK3in high•impedance state.

CSEL is the circuit for selecting one clock out of two input clocks tobe outputted to DIVM. One of the input clocks is a CLK3 signal outputtedby OCM of the relevant LSI, and the other is a clock signal outputted byOCM of another LSI, the latter being connected to thepenetration-electrode TSVCS1 via CLK4. A signal serving as a source forsuch selection is stored in the part of the memory element (CKREG)inside CALL to be posted to CSEL by a CTR 2 signal. Further, thissetting can be made after LSI activation, and the initial value thereofindicates the CLK3 signal in as-selected state. DIVM is a circuitincluding a frequency-division function for executing frequency-divisionof a signal obtained from CSEL, thereby outputting the signal as the LSIinternal clock to CALL.

With the configuration shown in FIG. 12, the clock signal generated byOCM inside LSIL_0 is in use in all the LSIs. With the adoption of theconfiguration described, the clock signal generated by one OCM can beutilized in a plurality of the LSIs that are stacked one another. IfOCMs differing from each other on a LSI-by-LSI basis are used, this willraise a possibility that a difference in clock frequency between theLSIs will increase due to, for example, a difference in power sourcevoltage between the LSIs. In contrast, with the use of the semiconductorapparatus according to the second embodiment of the invention, thedifference in clock frequency between the LSIs differing from each otherwill decrease to thereby enable communication low in latency, and highin throughput to be established, and in addition, it is possible toreduce the number of stages of a buffer circuit (for example, RFIFO, inFIGS. 3, and 11) as a part of a circuit for communication between LSIs,via the penetration-electrode, thereby enabling simplification incontrol and reduction in circuit scale.

Thus, with the use of the semiconductor apparatus according to thesecond embodiment of the invention, clocks are easily synchronizedbetween the respective LSIs typically in respect of the stacked LSIs, sothat communication low in latency, and high in throughput is enabled.

Third Embodiment

FIG. 7 is a schematic representation showing one example of aconfiguration of a semiconductor apparatus according to a thirdembodiment of the invention. In FIG. 7, the case of a stacked structurewherein a plurality of memory LSIs (LSIMs) are piled up on the pluralityof the logic LSIs (LSILs), shown in FIG. 1, is taken by way of example,and there is shown an example of placements of respectivepenetration-electrode groups on each of LSIs. LSIW denotes an interposerLSI for aligning positions of the respective penetration-electrodegroups on LSIL with positions of those on LSIM. In general, LSIL differsin size and so forth from LSIM, and it is difficult to align respectiveterminal positions with each other among various products. Accordingly,the respective terminal positions are altered by virtue of LSIW. By sodoing, a common LSI can be used for various products, thereby enhancingflexibility in application.

In FIG. 7, TSVGL denotes the penetration-electrode group forestablishing communication between the LSIs, TSVGM thepenetration-electrode group for establishing communication between thelogic LSI, and the memory LSI, TSVGPL the penetration-electrode groupfor feeding power supply and ground to the logic LSI, and TSVGPM thepenetration-electrode group for feeding power supply and ground to thememory LSI in an upper layer. Further, a logic block LGC is a circuitportion of the logic LSI, other than the penetration-electrode group,LGC including a processor and so forth, and a memory block MEM is aportion of the memory LSI, other than the penetration-electrode group.LGC includes a plurality of processor circuits PU, and MEM includes aplurality of memory arrays. Further, TSVGPM is the penetration-electrodegroup that is not used in the logic LSI, connecting electrodes on thesurface of the logic LSI to electrodes on the rear surface thereof. As aresult of installation of the penetration-electrode group not connectedto the LSI in the lower layer, a power supply voltage different fromthat for the LSI in the lower layer can be stably fed to the LSI in theupper layer. Without the installation of the penetration-electrodegroup, there can be available a method for feeding power supply to theLSIs in the upper layers by use of a bonding wire, however, in thiscase, depending on consumed power of the LSI in the upper layer, it isdifficult to stably feed power supply thereto.

In the case where such a multilayer configuration is adopted, TSVGM in aband-like form is placed at the center of the LSI as one of features ofplacements of the penetration-electrode s for communication. Circuitssuch as a processor and so forth, mounted on the logic LSI, basicallydiffers in size from memory array circuits in the memory LSI. For thisreason, if TSVGMs are disposed in a dispersed fashion in the vicinity ofthe respective circuits, a block for the circuits in the logic LSI isrequired to match in size with a block for the circuits in the memoryLSI, so that the configuration will be under severe constraints, therebyrendering it difficult to adopt an optimal configuration. It will bedifficult to vary function/performance, memory capacity, and so forth ona product-by-product basis. Since the memory LSI, in particular, is anLSI high in flexibility, it is necessary to select a memory LSI suitablefor a product's application out of a lineup of memory LSIs manufacturedfor general purpose, differing in capacity and performance from eachother, and to enable the memory LSI as selected to be piled up on thelogic LSI. Further, even if there is a change in a process formanufacturing the memory LSI, and the logic LSI, resulting in a changein circuit size, it is also necessary to be able to effect connection inthe same way as before. If TSVGMs are concentrated in the central regionas in the case of the present embodiment to thereby adopt a commonspecification, those requirements can be met.

Further, another feature of the placements of the penetration-electrodes lies in that TSVGLs serving as respective communication paths betweenthe LSIs, are disposed in a dispersed fashion within LGC. With thepresent embodiment, the penetration-electrode groups Stags are disposedin the vicinity of respective Pus. If the communication paths aregathered together at one spot, flexibility will be enhanced as describedabove on one hand, but this will cause an increase in interconnectionlength, so that a demerit in terms of performance will often result.Such placements in the dispersed fashion as described above haveadvantageous effects such as lower latency in communication between thecircuits of the stacked LSIs, and reduction in interconnection area.Further, in the case of communication between identical LSIs,flexibility becomes insignificant.

Further, the penetration-electrode group for power supply and groundingis disposed in an outer peripheral region of the LSI. This has anadvantageous effect that flexibility is imparted to the circuits in thelogic LSI, and the circuits in the memory LSI just as in the case whereTSVGMs are concentrated in the central region. Even if a change occursto, for example, the circuits mounted on the logic LSI, causing a changein circuit size, and the number of the circuits mounted, the same logicLSI as used in the past can be piled up on the memory LSI. Furthermore,the penetration-electrode group for power supply and grounding, TSVGPM,to be connected to the LSI in the upper layer (in this example, thememory LSI), is disposed on the outer side of the penetration-electrodegroup for power supply and grounding, TSVGPL, to be connected to the LSIin the lower layer (the LSI on a side of the semiconductor apparatus,adjacent to a package board PKGB; in this example, the logic LSI).Placement of TSVGPM on the outermost side can have an advantageouseffect that the LSI in the upper layer can make effective use of a widercontinuative area. Further, power supply and ground are directlyconnected to a functional circuit part on the plane of the LSI in thelower layer, which also has an advantageous effect of stabilization inpower supply. Further, with the present embodiment, LSIL differs in sizefrom LSIM, and placement of TSVGPM in LSIL differs from that in LSIM.For this reason, LSIW serving as the interposer LSI is insertedtherebetween, thereby connecting TSVGPM in LSIL to TSVGPM in LSIM.

Still further, there is available another configuration ofpenetration-electrode s, wherein respective penetration-electrode s forpower supply differ in diameter and pitch between the electrodes fromrespective penetration-electrode s for communication. This configurationis effective in terms of compatibility between stable power supplyvoltage, and high-speed signal transmission. In the case of thepenetration-electrode for power supply, there is the need for reducing aresistance value in order to reduce a power supply voltage drop. Anelectrode area per unit LSI area can be increased by enlarging thediameter of the penetration-electrode to thereby reduce resistance.Further, in such a case, there will also occur an increase in electriccapacity, which is preferable for power supply. On the other hand, inthe case of the penetration-electrode for communication, enlargement indiameter is not preferably because an increase in electric capacity willlead to a lower transmission speed.

Thus, with the use of the semiconductor apparatus according to the thirdembodiment of the invention, degree of freedom (flexibility) istypically enhanced in combination of the respective LSIs in the case ofthe stacked LSIs. This is attained mainly by placing thepenetration-electrode group in the band-like form, serving as acommunication path between the logic LSI, and the memory LSI, at thecenter of a chip, and disposing the penetration-electrode group for apower supply system on the outer periphery of the LSI. Further, lowerlatency in communication can be realized by disposing thepenetration-electrode s serving as the respective communication pathsbetween the logic LSIs. Furthermore, the LSI in the lower layer isprovided with the penetration-electrode group (in this case, thepenetration-electrode group for power supply to the memory LSI), notconnected to the LSI in the lower layer, and for use only in the LSI inthe upper layer, and the penetration-electrode group described isdisposed on the outer periphery of the LSI in the power layer, so thatthe LSI in the lower layer can make effective use of a continuativearea.

Fourth Embodiment

FIG. 9 is a schematic representation showing one example of aconfiguration of a semiconductor apparatus according to a fourthembodiment of the invention. In the figure, there is shown, an exampleof placements of respective penetration-electrode groups in the casewhere a stacked structure differing from that shown in FIG. 7 isadopted. LSIC deposited in the lowermost layer denotes a communication.LSI with a plurality of communication circuits for communication withoutside LSIs, mounted thereon, LSIM a memory LSI, and LSIL a logic LSI.The circuits of stacked LSIs, for use in communication with outside thestacked LSIs, are independently provided in LSIC, so that LSIL has noneed for a circuit for use in communication with outside the stackedLSIs, thereby enhancing area efficiency.

TSVGLA is a penetration-electrode group for establishing communicationbetween the communication LSI, and the logic LSI, TSVGLB apenetration-electrode group for connection between the logic LSIs, andTSVGM a penetration-electrode group for establishing communicationbetween the logic LSI, and the memory LSI. TSVGLA and TSVGLB each arethe penetration-electrode group that is not used in the memory LSI,having a structure for connecting a surface electrode of the memory LSIto a rear surface electrode thereof without being connected tofunctional circuits inside the memory LSI. However, there can be aconfiguration wherein repeater circuits are connected together insidethe memory LSI.

Thus, if the penetration-electrode groups (TSVGLA and TSVGLB, in LSIM)not used in respective LSIs in intermediate layers, and forcommunication between the LSIs in upper and lower layers thereof,respectively, are provided on the LSIs piled up in the intermediatelayers, this will enable communication high in throughput to beestablished between the LSIs above, and below the penetration-electrodegroup, respectively.

TSVGPL is a penetration-electrode group for feeding power supply andground to the logic LSI, and TSVGPL in the memory LSI is not used as(not connected to) an internal power supply, and ground inside thememory LSI, having a structure for connecting the surface electrode ofthe memory LSI to the rear surface electrode thereof. TSVGPM is apenetration-electrode group for feeding power supply and ground to thememory LSI, and TSVGPM in the logic LSI is not used as (not connectedto) the internal power supply, and ground inside the memory LSI, havinga structure for connecting a surface electrode of the logic LSI to arear surface electrode thereof. CMC denotes an external communicationcircuits for establishing communication with outside the stacked LSIs,and LGCC denotes a penetration-electrode group in the communication LSI,and a circuit portion thereof, other than CMC. A logic block LGC is acircuit portion of the logic LSI, other than the penetration-electrodegroup in the logic LSI, and a memory block MEM is a circuit portion ofthe memory LSI, other than the penetration-electrode group in the memoryLSI, such as a memory array, and so forth.

Thus, with the use of the semiconductor apparatus according to thefourth embodiment of the invention, the following effects are typicallygained. More specifically, in the case of the multilayer configurationcomposed of LSIs of not less than three kinds, as shown in FIG. 9, and amultilayer configuration with nested LSIs, as opposed to the case of theconfiguration shown in FIG. 7, wherein two kinds of LSIs aresequentially connected to each other, communication is required betweenLSIs that are not directly opposed to each other. Accordingly, if theLSI is provided with the penetration-electrode groups for signaling, notfor use inside the LSI itself, as shown in FIG. 9, this will beeffective from the standpoint of high throughput. Furthermore, if notonly those penetration-electrode groups for signaling but also thepenetration-electrode group for power supply (for example, TSVGPL inLSIM) are disposed in the outer peripheral region of the LSI, this willincrease degree of freedom in placement of the functional circuitsinside the LSI.

Having specifically described the invention developed by the inventor onthe basis of the embodiments of the invention as above, it is to beunderstood that the invention be not limited thereto, and that variouschanges and modification can be made in the invention without departingfrom the spirit and scope of the invention.

The semiconductor apparatus according to any of those embodimentsdescribed in the foregoing is useful particularly when applied tostacked LSIs wherein a plurality of logic LSI chips, a plurality ofmemory LSI chips, and so forth are piled up in multilayer, establishingcommunication therebetween via each of penetration-electrode groups.However, applicability is not limited thereto, and the semiconductorapparatus according to the invention is also applicable to respectiveLSI chips mounted in the stacked LSIs, as a single body.

1-16. (canceled)
 17. A semiconductor apparatus comprising: a pluralityof logic semiconductor chips each including a processor; a memorysemiconductor chip stacked in a layer above or below the plurality oflogic semiconductor chips; and a plurality of penetration-electrodes,wherein a penetration-electrode among the plurality of thepenetration-electrodes, for use in establishing communication betweenthe memory semiconductor chip and the plurality of the logicsemiconductor chips, is disposed in such a way as to be in a band-likeform and a central region in each of the plurality of logicsemiconductor chips and the memory semiconductor chip, and whereinpenetration-electrodes among the plurality of thepenetration-electrodes, for use in establishing communication among theplurality of the logic semiconductor chips, are disposed in a dispersedfashion inside a region of each of the plurality of the logicsemiconductor chips.
 18. The semiconductor apparatus according to claim17, wherein a penetration-electrode not connected to an internal circuitof one of the semiconductor chips, and feeding through between a frontsurface and a rear surface of the one semiconductor chip, is disposed inan outer peripheral region of the one semiconductor chip. 19-21.(canceled)
 22. The semiconductor apparatus according to claim 17,wherein a penetration-electrode not connected to an internal transistorcircuit of one of the semiconductor chips, and feeding through between afront surface electrode and a rear surface electrode of the onesemiconductor chip, is disposed in an outer peripheral region of the onesemiconductor chip.
 23. The semiconductor apparatus according to claim17, wherein an interposer LSI feeding through between the plurality ofthe logic semiconductor chips and the memory semiconductor chip isprovided.